1. Product Destruction Condition Verification
Product destruction condition verification is an important process during BOI Scrap Inspection to ensure rejected or defective electronic products cannot be reused, resold, repaired, or re-enter the market illegally.
The destruction process must be visible, traceable, and properly documented.
Objectives of Product Destruction Verification
- Prevent unauthorized reuse of defective products
- Ensure BOI and customs compliance
- Confirm products are permanently non-functional
- Protect intellectual property and brand reputation
- Avoid grey market resale
- Support environmental disposal requirements
Common Product Destruction Methods for Electronic Products
A. Physical Crushing / Breaking
Used for:
- PCB boards
- PCBA assemblies
- Electronic modules
- Plastic housings
Verification Points
- Board broken into multiple pieces
- Critical circuits damaged
- Components detached
- Product cannot be repaired
Inspector Checks
- Visual confirmation
- Destruction percentage
- Random sample verification
- Photo evidence
B. Cutting / Shearing
Used for:
- Cables
- Connectors
- Wiring harnesses
- Flexible circuits
Verification Points
- Multiple cut locations
- Connector unusable
- Copper conductor separated
Inspector Checks
- Number of cuts
- Length destroyed
- Complete separation confirmation