{"id":2921,"date":"2026-04-20T01:57:50","date_gmt":"2026-04-20T01:57:50","guid":{"rendered":"https:\/\/www.advantage.co.th\/?p=2921"},"modified":"2026-04-20T01:57:54","modified_gmt":"2026-04-20T01:57:54","slug":"bare-pcb-manufacturing-high-scrap-areas","status":"publish","type":"post","link":"https:\/\/www.advantage.co.th\/th\/bare-pcb-manufacturing-high-scrap-areas\/","title":{"rendered":"Bare PCB Manufacturing \u2013 High Scrap Areas"},"content":{"rendered":"<p>Scrap and NG (non-good) are usually not random\u2014they concentrate in a few <strong>high-risk processes<\/strong> where variation, material sensitivity, and process control gaps exist<\/p>\n\n\n\n<h1 class=\"wp-block-heading\">\ud83d\udd37 1. Bare PCB Manufacturing \u2013 High Scrap Areas<\/h1>\n\n\n\n<h2 class=\"wp-block-heading\">\ud83d\udfe0 a) Lamination Process<\/h2>\n\n\n\n<p><strong>Common NG:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Delamination<\/li>\n\n\n\n<li>Voids \/ air bubbles<\/li>\n\n\n\n<li>Resin starvation<\/li>\n<\/ul>\n\n\n\n<p><strong>Why it happens:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Improper temperature\/pressure profile<\/li>\n\n\n\n<li>Moisture in prepreg<\/li>\n\n\n\n<li>Incorrect lay-up alignment<\/li>\n<\/ul>\n\n\n\n<p>\ud83d\udc49 <strong>Impact:<\/strong> Internal defects \u2192 cannot rework \u2192 <strong>100% scrap<\/strong><\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\">\ud83d\udfe0 b) Drilling Process<\/h2>\n\n\n\n<p><strong>Common NG:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Misregistration (hole shift)<\/li>\n\n\n\n<li>Broken drill bits \u2192 rough holes<\/li>\n\n\n\n<li>Nail-heading<\/li>\n<\/ul>\n\n\n\n<p><strong>Root causes:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Worn-out drill bits<\/li>\n\n\n\n<li>Stack height variation<\/li>\n\n\n\n<li>Poor machine calibration<\/li>\n<\/ul>\n\n\n\n<p>\ud83d\udc49 Critical for multilayer PCB \u2192 affects connectivity<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\">\ud83d\udfe0 c) Plating (PTH \/ Copper Plating)<\/h2>\n\n\n\n<p><strong>Common NG:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Void in via (open circuit risk)<\/li>\n\n\n\n<li>Thin copper plating<\/li>\n\n\n\n<li>Overplating \/ nodules<\/li>\n<\/ul>\n\n\n\n<p><strong>Root causes:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Poor bath chemistry control<\/li>\n\n\n\n<li>Agitation issues<\/li>\n\n\n\n<li>Contamination<\/li>\n<\/ul>\n\n\n\n<p>\ud83d\udc49 One of the <strong>highest scrap contributors<\/strong> because defects are internal and hidden<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\">\ud83d\udfe0 d) Etching Process<\/h2>\n\n\n\n<p><strong>Common NG:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Over-etch \u2192 open circuit<\/li>\n\n\n\n<li>Under-etch \u2192 short circuit<\/li>\n\n\n\n<li>Line width variation<\/li>\n<\/ul>\n\n\n\n<p><strong>Root causes:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Etchant concentration variation<\/li>\n\n\n\n<li>Conveyor speed mismatch<\/li>\n\n\n\n<li>Resist issues<\/li>\n<\/ul>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\">\ud83d\udfe0 e) Solder Mask Application<\/h2>\n\n\n\n<p><strong>Common NG:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Misalignment<\/li>\n\n\n\n<li>Pinholes<\/li>\n\n\n\n<li>Poor adhesion<\/li>\n<\/ul>\n\n\n\n<p><strong>Root causes:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Exposure issues<\/li>\n\n\n\n<li>Contamination<\/li>\n\n\n\n<li>Improper curing<\/li>\n<\/ul>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h1 class=\"wp-block-heading\">\ud83d\udd37 2. PCBA (Assembly Process) \u2013 Major NG &amp; Scrap Drivers<\/h1>\n\n\n\n<h2 class=\"wp-block-heading\">\ud83d\udd34 a) Solder Paste Printing (MOST CRITICAL)<\/h2>\n\n\n\n<p><strong>~60\u201370% of defects originate here<\/strong><\/p>\n\n\n\n<p><strong>Common NG:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Insufficient solder<\/li>\n\n\n\n<li>Excess solder<\/li>\n\n\n\n<li>Solder bridging<\/li>\n\n\n\n<li>Misalignment<\/li>\n<\/ul>\n\n\n\n<p><strong>Root causes:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Stencil design issues<\/li>\n\n\n\n<li>Printer setup (pressure\/speed)<\/li>\n\n\n\n<li>Paste quality \/ viscosity<\/li>\n<\/ul>\n\n\n\n<p>\ud83d\udc49 This is your <strong>#1 yield driver<\/strong><\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\">\ud83d\udd34 b) Pick &amp; Place Process<\/h2>\n\n\n\n<p><strong>Common NG:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Missing components<\/li>\n\n\n\n<li>Wrong placement<\/li>\n\n\n\n<li>Misalignment<\/li>\n<\/ul>\n\n\n\n<p><strong>Root causes:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Feeder issues<\/li>\n\n\n\n<li>Vision alignment error<\/li>\n\n\n\n<li>Program mistakes<\/li>\n<\/ul>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\">\ud83d\udd34 c) Reflow Soldering<\/h2>\n\n\n\n<p><strong>Common NG:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Tombstoning<\/li>\n\n\n\n<li>Cold solder joints<\/li>\n\n\n\n<li>Voids in solder<\/li>\n\n\n\n<li>Component damage<\/li>\n<\/ul>\n\n\n\n<p><strong>Root causes:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Incorrect reflow profile<\/li>\n\n\n\n<li>Thermal imbalance<\/li>\n\n\n\n<li>PCB design issues<\/li>\n<\/ul>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\">\ud83d\udd34 d) Wave Soldering (for THT)<\/h2>\n\n\n\n<p><strong>Common NG:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Solder bridges<\/li>\n\n\n\n<li>Insufficient fill<\/li>\n\n\n\n<li>Icicles<\/li>\n<\/ul>\n\n\n\n<p><strong>Root causes:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Flux inconsistency<\/li>\n\n\n\n<li>Wave height variation<\/li>\n\n\n\n<li>Conveyor speed<\/li>\n<\/ul>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\">\ud83d\udd34 e) Manual Soldering \/ Repair<\/h2>\n\n\n\n<p><strong>Common NG:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Overheating damage<\/li>\n\n\n\n<li>Poor solder joints<\/li>\n\n\n\n<li>Lifted pads<\/li>\n<\/ul>\n\n\n\n<p>\ud83d\udc49 High variation due to <strong>human factor<\/strong><\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h1 class=\"wp-block-heading\">\ud83d\udd37 3. Component &amp; Material Related Issues<\/h1>\n\n\n\n<h2 class=\"wp-block-heading\">\ud83d\udfe1 a) Incoming Material Defects<\/h2>\n\n\n\n<p><strong>\u0e15\u0e31\u0e27\u0e2d\u0e22\u0e48\u0e32\u0e07:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Warped PCB<\/li>\n\n\n\n<li>Oxidized pads<\/li>\n\n\n\n<li>Component lead issues<\/li>\n<\/ul>\n\n\n\n<p>\ud83d\udc49 Weak IQC = downstream scrap explosion<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\">\ud83d\udfe1 b) Moisture Sensitivity (MSL Components)<\/h2>\n\n\n\n<p><strong>Common NG:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Popcorning<\/li>\n\n\n\n<li>Cracked ICs<\/li>\n<\/ul>\n\n\n\n<p>\ud83d\udc49 Especially critical for BGA\/QFN packages<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h1 class=\"wp-block-heading\">\ud83d\udd37 4. Inspection &amp; Test Escape (Hidden Scrap Drivers)<\/h1>\n\n\n\n<h2 class=\"wp-block-heading\">\ud83d\udfe3 a) AOI \/ SPI \/ AXI Inefficiency<\/h2>\n\n\n\n<p><strong>Issues:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>False calls \u2192 rework cost<\/li>\n\n\n\n<li>Missed defects \u2192 field failure<\/li>\n<\/ul>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\">\ud83d\udfe3 b) ICT \/ Functional Test Failures<\/h2>\n\n\n\n<p><strong>Common NG:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Open\/short circuits<\/li>\n\n\n\n<li>Programming failure<\/li>\n<\/ul>\n\n\n\n<p>\ud83d\udc49 Late-stage failures = <strong>highest cost scrap<\/strong><\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h1 class=\"wp-block-heading\">\ud83d\udd37 5. High Scrap Zones Summary (Priority Ranking)<\/h1>\n\n\n\n<p>From industry experience + yield impact:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Solder Paste Printing (SPI control failure)<\/strong><\/li>\n\n\n\n<li><strong>Reflow Profile Issues<\/strong><\/li>\n\n\n\n<li><strong>Plating (via defects \u2013 hidden scrap)<\/strong><\/li>\n\n\n\n<li><strong>Etching (open\/short circuits)<\/strong><\/li>\n\n\n\n<li><strong>Material Quality (PCB + components)<\/strong><\/li>\n\n\n\n<li><strong>Manual handling &amp; rework damage<\/strong><\/li>\n<\/ol>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h1 class=\"wp-block-heading\">\ud83d\udd37 6. Key Quality Engineer Focus Areas (Your Interview Edge)<\/h1>\n\n\n\n<p>You can frame this like a pro:<\/p>\n\n\n\n<p>\ud83d\udc49 Focus on <strong>3 control pillars<\/strong>:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">1. Prevention (Best ROI)<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>SPI control (Cp\/Cpk > 1.33)<\/li>\n\n\n\n<li>Reflow profile validation<\/li>\n\n\n\n<li>Supplier quality control<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">2. Detection<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>AOI + AXI optimization<\/li>\n\n\n\n<li>ICT coverage improvement<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">3. Reaction<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>8D for top defects<\/li>\n\n\n\n<li>Pareto analysis for scrap<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"<p>Scrap and NG (non-good) are usually not random\u2014they concentrate in a few high-risk processes where variation, material sensitivity, and process control gaps exist \ud83d\udd37 1. Bare PCB Manufacturing \u2013 High Scrap Areas \ud83d\udfe0 a) Lamination Process Common NG: Why it happens: \ud83d\udc49 Impact: Internal defects \u2192 cannot rework \u2192 100% scrap \ud83d\udfe0 b) Drilling Process [&hellip;]<\/p>\n","protected":false},"author":3,"featured_media":2433,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[15],"tags":[54,227,228,223,48,83],"class_list":["post-2921","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-boi-scrap","tag-boi-inspection","tag-environmental-compliance-needed","tag-machine-breakdown","tag-plastic-runner-from-injection-molding","tag-scrap-2","tag-third-party-inspection-service"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Bare PCB Manufacturing \u2013 High Scrap Areas - Advantage<\/title>\n<meta name=\"description\" content=\"Most scrap in PCB manufacturing is not evenly distributed. 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Ltd\",\"url\":\"https:\\\/\\\/www.advantage.co.th\\\/en\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"th\",\"@id\":\"https:\\\/\\\/www.advantage.co.th\\\/en\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/www.advantage.co.th\\\/wp-content\\\/uploads\\\/2025\\\/07\\\/261294102_1859549597585101_82764-e1751863923702.webp\",\"contentUrl\":\"https:\\\/\\\/www.advantage.co.th\\\/wp-content\\\/uploads\\\/2025\\\/07\\\/261294102_1859549597585101_82764-e1751863923702.webp\",\"width\":175,\"height\":125,\"caption\":\"Advantage Co. Ltd\"},\"image\":{\"@id\":\"https:\\\/\\\/www.advantage.co.th\\\/en\\\/#\\\/schema\\\/logo\\\/image\\\/\"},\"sameAs\":[\"https:\\\/\\\/www.facebook.com\\\/ACLinspection\",\"https:\\\/\\\/www.linkedin.com\\\/in\\\/aclinspection\\\/\"]},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.advantage.co.th\\\/en\\\/#\\\/schema\\\/person\\\/5d079d592c12254a245bcb70f33fe3b8\",\"name\":\"admin@advantage\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"th\",\"@id\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/7932b2e116b076a54f452848eaabd5857f61bd957fe8a218faf216f24c9885bb?s=96&d=mm&r=g\",\"url\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/7932b2e116b076a54f452848eaabd5857f61bd957fe8a218faf216f24c9885bb?s=96&d=mm&r=g\",\"contentUrl\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/7932b2e116b076a54f452848eaabd5857f61bd957fe8a218faf216f24c9885bb?s=96&d=mm&r=g\",\"caption\":\"admin@advantage\"},\"url\":\"https:\\\/\\\/www.advantage.co.th\\\/th\\\/author\\\/adminadvantage\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Bare PCB Manufacturing \u2013 High Scrap Areas - Advantage","description":"Most scrap in PCB manufacturing is not evenly distributed. It is highly concentrated in early-stage process variations like solder paste printing and hidden defects like plating voids. A strong quality system focuses on controlling these upstream processes rather than relying on downstream inspection","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.advantage.co.th\/th\/bare-pcb-manufacturing-high-scrap-areas\/","og_locale":"th_TH","og_type":"article","og_title":"Bare PCB Manufacturing \u2013 High Scrap Areas - Advantage","og_description":"Most scrap in PCB manufacturing is not evenly distributed. It is highly concentrated in early-stage process variations like solder paste printing and hidden defects like plating voids. A strong quality system focuses on controlling these upstream processes rather than relying on downstream inspection","og_url":"https:\/\/www.advantage.co.th\/th\/bare-pcb-manufacturing-high-scrap-areas\/","og_site_name":"Advantage","article_publisher":"https:\/\/www.facebook.com\/ACLinspection","article_published_time":"2026-04-20T01:57:50+00:00","article_modified_time":"2026-04-20T01:57:54+00:00","og_image":[{"width":1254,"height":836,"url":"https:\/\/www.advantage.co.th\/wp-content\/uploads\/2026\/01\/Electronic-Scrap.jpg","type":"image\/jpeg"}],"author":"admin@advantage","twitter_card":"summary_large_image","twitter_misc":{"Written by":"admin@advantage","Est. reading time":"3 \u0e19\u0e32\u0e17\u0e35"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.advantage.co.th\/bare-pcb-manufacturing-high-scrap-areas\/#article","isPartOf":{"@id":"https:\/\/www.advantage.co.th\/bare-pcb-manufacturing-high-scrap-areas\/"},"author":{"name":"admin@advantage","@id":"https:\/\/www.advantage.co.th\/en\/#\/schema\/person\/5d079d592c12254a245bcb70f33fe3b8"},"headline":"Bare PCB Manufacturing \u2013 High Scrap Areas","datePublished":"2026-04-20T01:57:50+00:00","dateModified":"2026-04-20T01:57:54+00:00","mainEntityOfPage":{"@id":"https:\/\/www.advantage.co.th\/bare-pcb-manufacturing-high-scrap-areas\/"},"wordCount":468,"publisher":{"@id":"https:\/\/www.advantage.co.th\/en\/#organization"},"image":{"@id":"https:\/\/www.advantage.co.th\/bare-pcb-manufacturing-high-scrap-areas\/#primaryimage"},"thumbnailUrl":"https:\/\/www.advantage.co.th\/wp-content\/uploads\/2026\/01\/Electronic-Scrap.jpg","keywords":["BOI Inspection","Environmental compliance needed","Machine breakdown","Plastic runner from injection molding","Scrap","Third-Party Inspection Service"],"articleSection":["BOI Scrap"],"inLanguage":"th"},{"@type":"WebPage","@id":"https:\/\/www.advantage.co.th\/bare-pcb-manufacturing-high-scrap-areas\/","url":"https:\/\/www.advantage.co.th\/bare-pcb-manufacturing-high-scrap-areas\/","name":"Bare PCB Manufacturing \u2013 High Scrap Areas - Advantage","isPartOf":{"@id":"https:\/\/www.advantage.co.th\/en\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.advantage.co.th\/bare-pcb-manufacturing-high-scrap-areas\/#primaryimage"},"image":{"@id":"https:\/\/www.advantage.co.th\/bare-pcb-manufacturing-high-scrap-areas\/#primaryimage"},"thumbnailUrl":"https:\/\/www.advantage.co.th\/wp-content\/uploads\/2026\/01\/Electronic-Scrap.jpg","datePublished":"2026-04-20T01:57:50+00:00","dateModified":"2026-04-20T01:57:54+00:00","description":"Most scrap in PCB manufacturing is not evenly distributed. It is highly concentrated in early-stage process variations like solder paste printing and hidden defects like plating voids. A strong quality system focuses on controlling these upstream processes rather than relying on downstream inspection","breadcrumb":{"@id":"https:\/\/www.advantage.co.th\/bare-pcb-manufacturing-high-scrap-areas\/#breadcrumb"},"inLanguage":"th","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.advantage.co.th\/bare-pcb-manufacturing-high-scrap-areas\/"]}]},{"@type":"ImageObject","inLanguage":"th","@id":"https:\/\/www.advantage.co.th\/bare-pcb-manufacturing-high-scrap-areas\/#primaryimage","url":"https:\/\/www.advantage.co.th\/wp-content\/uploads\/2026\/01\/Electronic-Scrap.jpg","contentUrl":"https:\/\/www.advantage.co.th\/wp-content\/uploads\/2026\/01\/Electronic-Scrap.jpg","width":1254,"height":836},{"@type":"BreadcrumbList","@id":"https:\/\/www.advantage.co.th\/bare-pcb-manufacturing-high-scrap-areas\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.advantage.co.th\/"},{"@type":"ListItem","position":2,"name":"Bare PCB Manufacturing \u2013 High Scrap Areas"}]},{"@type":"WebSite","@id":"https:\/\/www.advantage.co.th\/en\/#website","url":"https:\/\/www.advantage.co.th\/en\/","name":"https:\/\/www.advantage.co.th\/","description":"Quality in Quality Control and Inspection","publisher":{"@id":"https:\/\/www.advantage.co.th\/en\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.advantage.co.th\/en\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"th"},{"@type":"Organization","@id":"https:\/\/www.advantage.co.th\/en\/#organization","name":"Advantage Co. Ltd","url":"https:\/\/www.advantage.co.th\/en\/","logo":{"@type":"ImageObject","inLanguage":"th","@id":"https:\/\/www.advantage.co.th\/en\/#\/schema\/logo\/image\/","url":"https:\/\/www.advantage.co.th\/wp-content\/uploads\/2025\/07\/261294102_1859549597585101_82764-e1751863923702.webp","contentUrl":"https:\/\/www.advantage.co.th\/wp-content\/uploads\/2025\/07\/261294102_1859549597585101_82764-e1751863923702.webp","width":175,"height":125,"caption":"Advantage Co. Ltd"},"image":{"@id":"https:\/\/www.advantage.co.th\/en\/#\/schema\/logo\/image\/"},"sameAs":["https:\/\/www.facebook.com\/ACLinspection","https:\/\/www.linkedin.com\/in\/aclinspection\/"]},{"@type":"Person","@id":"https:\/\/www.advantage.co.th\/en\/#\/schema\/person\/5d079d592c12254a245bcb70f33fe3b8","name":"admin@advantage","image":{"@type":"ImageObject","inLanguage":"th","@id":"https:\/\/secure.gravatar.com\/avatar\/7932b2e116b076a54f452848eaabd5857f61bd957fe8a218faf216f24c9885bb?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/7932b2e116b076a54f452848eaabd5857f61bd957fe8a218faf216f24c9885bb?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/7932b2e116b076a54f452848eaabd5857f61bd957fe8a218faf216f24c9885bb?s=96&d=mm&r=g","caption":"admin@advantage"},"url":"https:\/\/www.advantage.co.th\/th\/author\/adminadvantage\/"}]}},"_links":{"self":[{"href":"https:\/\/www.advantage.co.th\/th\/wp-json\/wp\/v2\/posts\/2921","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.advantage.co.th\/th\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.advantage.co.th\/th\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.advantage.co.th\/th\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/www.advantage.co.th\/th\/wp-json\/wp\/v2\/comments?post=2921"}],"version-history":[{"count":1,"href":"https:\/\/www.advantage.co.th\/th\/wp-json\/wp\/v2\/posts\/2921\/revisions"}],"predecessor-version":[{"id":2922,"href":"https:\/\/www.advantage.co.th\/th\/wp-json\/wp\/v2\/posts\/2921\/revisions\/2922"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.advantage.co.th\/th\/wp-json\/wp\/v2\/media\/2433"}],"wp:attachment":[{"href":"https:\/\/www.advantage.co.th\/th\/wp-json\/wp\/v2\/media?parent=2921"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.advantage.co.th\/th\/wp-json\/wp\/v2\/categories?post=2921"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.advantage.co.th\/th\/wp-json\/wp\/v2\/tags?post=2921"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}